Technical Program Committee

Technical Program Co-Chairs

Yingying Chen, Stevens Institute of Technology, USA
Tilman Wolf, University of Massachusetts Amherst, USA

Area Chairs

Yan Chen, Northwestern University
Amir Herzberg, Bar-Ilan University, Israel
Guevara Noubir, Northeastern University, USA
Panagiotis Papadimitratos, KTH, Sweden
Pierangela Samarati, 
Università degli Studi di Milano, Italy
Guoliang Xue, Arizona State University, USA
Yanchao Zhang, Arizona State University, USA
Sencun Zhu, The Pennsylvania State University, USA


Technical Program Committee

Ehab Al-Shaer, University of North Carolina Charlotte, USA
Raheem Beyah, Georgia Institute of Technology, USA
Giuseppe Bianchi, University of Rome "Tor Vergata", Italy
Erik-Oliver Blass, Airbus Group Innovations, Germany
Guohong Cao, The Pennsylvania State University, USA
Yinzhi Cao, Lehigh University, USA
Danai Chasaki, Villanova University, USA
Hao Chen, University of California, Davis, USA
Songqing Chen, George Mason University, USA
Xiuzhen Cheng, George Washington Univ, USA
Sherman S. M. Chow, The Chinese University of Hong Kong, Hong Kong
Mauro Conti, University of Padua, Italy
Sabrina De Capitani di Vimercati, Università degli Studi di Milano, Italy
Roberto Di Pietro, Bell Labs, France
Yingfei Dong, University of Hawaii, USA
Faramarz Fekri, Georgia Institute of Technology, USA
Xinwen Fu, University of Massachusetts Lowell, USA
Guang Gong, University of Waterloo, Canada
Guofei Gu, Texas A&M University, USA
Zhongshu Gu, IBM Research, USA

Yong Guan, Iowa State University, USA
Thomas Halford, WPL, Inc., USA
Daniel Holcomb, UMass Amherst, USA
Matthias Hollick, Technische Universität Darmstadt, Germany
Loukas Lazos, University of Arizona, USA
Albert Levi, Sabanci University, Turkey
Ming Li, University of Arizona, USA
Qun Li, College of William and Mary, USA
Peng Liu, Pennsylvania State University, USA
Yao Liu, University of South Florida, USA
Wenjing Lou, Virginia Tech, USA
Ashraf Matrawy, Carleton University, Canada
Wojciech Mazurczyk, Warsaw University of Technology, Poland
Chad Meiners, MIT Lincoln Laboratory, USA
Tommaso Melodia, Northeastern University, USA
Aziz Mohaisen, Verisign Labs, USA
Refik Molva, Insitut Eurecom, France
Jung-Min (Jerry) Park, Virginia Tech, USA
Chunyi Peng, The Ohio State University, USA
Christina Poepper, New York University Abu Dhabi, UAE
Walid Saad, Virginia Tech, USA
Dong-Hoon Shin, AT&T Labs, USA
Seungwon Shin, KAIST, Korea
Tao Shu, Oakland University, USA
Mukesh Singhal, University of California at Merced, USA
Aaron Striegel, University of Notre Dame, USA
Thorsten Strufe, TU Dresden, Germany
Kun Sun, College of William & Mary, USA
Neeraj Suri, Technische Universitaet Darmstadt, Germany
Patrick Tague, Carnegie Mellon University, USA
Chiu Tan, Temple University, USA
Bishal Thapa, Raytheon BBN Technology, USA
Ari Trachtenberg, Boston University, USA
A. Selcuk Uluagac, Florida International University, USA
Cliff Wang, Army Research Office, USA
Cong Wang, City University of Hong Kong, Hong Kong
Honggang Wang, University of Massachusetts, Dartmouth, USA
Yan Wang, Binghamton University, USA
Tao Wei, FireEye Inc., USA
Wenyuan Xu, University of South Carolina, USA
Jie Yang, Florida State University, USA
Shanchieh Yang, Rochester Institute of Technology, USA
Danfeng Yao, Virginia Tech, USA
Vinod Yegneswaran, SRI International, USA
Adam Young, Cryptovirology Labs, USA
Meng Yu, University of Texas at San Antonio, USA
Shucheng Yu, University of Arkansas at Little Rock

David Zage, Intel Corporation, USA
Kai Zeng, George Mason University, USA
Rui Zhang, University of Hawaii, USA
Quanyan Zhu, New York University, USA